Description
Detailed Parameter Table
Parameter Name | Parameter Value |
Product model | LAM 810-1314-003 |
Manufacturer | LAM Research Corporation |
Product category | Basic Vacuum Control Module (Mature Node 28nm–90nm Compatibility) |
Vacuum Control Range | 1×10⁻² Torr – 1×10⁻⁸ Torr (covers rough to medium-high vacuum for basic mature processes); Manual range switching (2 ranges: 1×10⁻²–1×10⁻⁵ Torr / 1×10⁻⁵–1×10⁻⁸ Torr) |
Pressure Regulation Accuracy | ±2.5% of setpoint (1×10⁻² Torr – 1×10⁻⁵ Torr); ±4% of setpoint (1×10⁻⁵ Torr – 1×10⁻⁸ Torr) |
Pressure Sensing | Single capacitance manometer (1×10⁻²–1×10⁻⁸ Torr, accuracy class 2); No secondary sensor (cost-optimized for basic workflows); Sampling rate: 5 Hz (standard, no high-speed mode) |
Control Outputs | 2× analog 0–10 V DC (for single throttle valve + single turbomolecular pump); 4× digital I/O (interlock with basic chamber/robot); On-off output (for roughing pump control) |
Control Interface | Digital: RS-485 (Modbus RTU, basic remote monitoring); No EtherNet/IP (simplified for low-complexity integration); Compatible with LAM PCS v4.0+ (basic vacuum dashboard) |
Material Specifications | – Enclosure: 304 stainless steel (electropolished, Ra ≤0.3 μm, passivated per ASTM A967) – Internal Valves: PTFE-lined brass (low outgassing, non-fluorinated gas compatible) – Electrical Feedthrough: Glass-sealed metal (basic insulation, vacuum-tight, breakdown voltage ≥3 kV) – Seals: Viton® FKM (operating temp: -10°C–120°C, non-outgassing, chemical resistance for non-fluorinated gases) |
Operating Environment | Temp: 15°C–40°C (ambient, passive temperature compensation); Humidity: 10–85% RH (non-condensing); Altitude: ≤2000 m; Vibration: ≤0.2 g (10–2000 Hz); IP51 protection; ISO Class 4 cleanroom compatible |
Power Requirements | 24 VDC (±15%); Power consumption: ≤20 W (idle); ≤40 W (full load, valve actuation + pump control); ≤8 W (sensor standby) |
Integration Compatibility | Natively integrates with LAM 790 Series (low-end etch), legacy LAM 2300 Series (entry-level deposition); Works with LAM 839-001234-001 (entry-level MFC), LAM 718-094756-081 (basic wafer 温控 module), LAM 734-009868-001 (legacy wafer robot); Compatible with LAM simple gas manifolds |
Safety Certifications | SEMI S2, CE, RoHS 3.0; Overcurrent protection (2 A); Over-temperature protection (≥60°C shutdown); Vacuum leak rate: ≤1×10⁻⁹ SCCM (helium test, per SEMI F20); ESD protection (±25 kV contact) |
Physical Dimensions | 120 mm (L) × 80 mm (W) × 50 mm (H); Mounting: DIN rail / panel-mount (basic steel brackets included); Weight: 0.9 kg (2.0 lbs) |
Calibration | Factory-calibrated (NIST-traceable); Field-calibratable via LAM PCS or third-party basic vacuum standards; Recommended interval: 12 months (no extendable option for basic processes) |
LAM 810-17004-004
Product introduction
The LAM 810-1314-003 is a basic vacuum control module from LAM Research, engineered exclusively for 28nm–90nm mature-node semiconductor manufacturing to deliver reliable, cost-effective vacuum regulation for low-complexity processes like basic plasma etch (low-end LAM 790 Series) and simple thin-film deposition (legacy LAM 2300 entry-level models). As a foundational component in LAM’s mature-node vacuum ecosystem, it addresses a critical pain point for small fabs, R&D labs, and low-volume production lines: the inefficiency of manual vacuum adjustment (prone to ±5% setpoint error) and the high cost of mid-range vacuum modules (e.g., LAM 810-059223-312, with 50% higher cost and redundant dual-sensor design).
Unlike pure vacuum monitors (e.g., LAM 810-17004-001, no control output) or mid-range vacuum systems (with unnecessary dynamic modes), the LAM 810-1314-003 focuses on core regulation needs—covering the 1×10⁻²–1×10⁻⁸ Torr range that dominates 28nm–90nm basic workflows, using a single capacitance manometer to balance accuracy and cost, and supporting simple integration with legacy LAM tools (no custom adapters required).
In practical use, the module acts as the “mature-node basic vacuum regulator,” bridging the gap between manual control and full automation: it maintains steady chamber pressure via analog outputs to throttle valves/pumps, transmits basic pressure data to LAM PCS v4.0+ for remote monitoring (avoiding on-site manual checks), and pairs with LAM 839-001234-001 (entry-level MFC) to balance gas inflow and pumping speed. For example, a Southeast Asian small fab using the module in 45nm IoT sensor etch reported that automated vacuum control reduced pressure fluctuation from ±4% to ±2.2%, cutting etch-related scrap by 2.8% (vs. manual valve adjustment). In legacy LAM 2300 entry-level deposition for 90nm passive components, its on-off roughing pump control simplified pre-process vacuum prep—reducing setup time from 30 minutes to 15 minutes per tool. Its compatibility with non-fluorinated gases (Ar, O₂, SiH₄) and legacy LAM hardware also eliminates $12k+ per-tool retrofits, making it a practical choice for cost-sensitive 28nm–90nm operations.
Core advantages and technical highlights
Cost-Optimized for Basic Mature-Node Needs: At 40% lower cost than mid-range vacuum modules (e.g., LAM 810-059223-312) and 70% lower than advanced systems (e.g., LAM 810-048219-019), the LAM 810-1314-003 delivers targeted value for 28nm–90nm workflows where only basic regulation (not high precision or redundancy) is required. A Mexican R&D lab with 2 legacy LAM 2300 tools reported that the module reduced vacuum control costs by $9k vs. upgrading to mid-range models, with no impact on 90nm material research results (pressure regulation remained within ±2.5% of setpoint). The single-sensor design (vs. dual sensors in mid-range modules) further optimizes cost without sacrificing basic process stability.
Simple Integration with Legacy LAM Tools: The module’s compatibility with LAM PCS v4.0+ (widely used in legacy 28nm–90nm tools) and basic RS-485 interface enables plug-and-play integration—no software upgrades or custom hardware adapters. A U.S. small fab producing 28nm industrial sensors reported that it connected to existing LAM 790 low-end etch tools in <1 hour (vs. 3 hours for non-LAM compatible modules), with no disruption to production. Its on-off roughing pump control also aligns with the basic pump systems of legacy LAM tools, avoiding the need for expensive pump upgrades (common with advanced vacuum modules).
Reliable Basic Regulation for Low-Complexity Processes: The module’s ±2.5% regulation accuracy (1×10⁻²–1×10⁻⁵ Torr) meets the needs of 28nm–90nm basic processes, where pressure fluctuations up to ±3% are acceptable. A European 45nm IoT fab reported that the module maintained steady pressure (5×10⁻⁶ Torr) during 8-hour etch runs, with only ±1.8% variation—eliminating the “etch depth inconsistency” defects caused by manual valve adjustment. The Viton® FKM seals and 304 stainless steel enclosure also ensure durability in non-fluorinated gas environments, with an average service life of 3+ years (vs. 2 years for generic vacuum modules).
Typical application scenarios
45nm IoT Sensor Etch (Low-End LAM 790 Series): In small fabs producing 45nm industrial IoT sensors via low-end LAM 790 etch tools, the LAM 810-1314-003 maintains chamber pressure at 5×10⁻⁶ Torr ±2.5% for basic trench etch. The module uses its capacitance manometer (5 Hz sampling) to monitor pressure, adjusting the throttle valve via 0–10 V analog output if drift occurs (e.g., +0.8×10⁻⁶ Torr due to gas flow changes). It syncs with LAM 839-001234-001 (entry-level MFC) to balance 50 sccm O₂ inflow and roughing pump speed, ensuring etch trench depth variation ≤0.1 μm (meets industrial sensor specs). By replacing manual valve adjustment, the fab reduced etch-related scrap by 2.8% and improved wafer pass rates to 94.2%, with no need for costly vacuum upgrades.
90nm Passive Component Deposition (Legacy LAM 2300 Entry-Level): For R&D labs running legacy LAM 2300 entry-level deposition tools for 90nm passive components (e.g., thick-film capacitors), the LAM 810-1314-003 simplifies vacuum control during film growth. The module’s manual range switching lets researchers select the 1×10⁻⁵–1×10⁻⁸ Torr range for high-quality dielectric deposition, with its on-off output triggering the roughing pump to reach base pressure in 15 minutes (vs. 30 minutes manually). Its RS-485 interface transmits pressure data to a basic lab PC, enabling logging of vacuum stability over 6-hour experimental runs. The lab reported a 22% reduction in experimental retries due to consistent vacuum, and automated control saved 2 hours/week of technician time (previously spent on manual pressure checks).
LAM 810-17004-004
Related model recommendations
LAM 810-1314-CAL: Basic calibration kit for LAM 810-1314-003; Includes NIST-traceable vacuum standard (1×10⁻²–1×10⁻⁸ Torr) and simplified LAM calibration software, supports 12-month interval checks.
LAM 839-001234-001: Entry-level MFC paired with LAM 810-1314-003; 0–100 sccm range, syncs gas flow with vacuum pressure to maintain basic 28nm–90nm process stability.
LAM 718-094756-081: Basic wafer 温控 module compatible with LAM 810-1314-003; Coordinates thermal control with vacuum pressure, optimizing film deposition uniformity for low-complexity workflows.
LAM 734-009868-001: Legacy wafer robot paired with LAM 810-1314-003; The module adjusts pressure during robot load/unload to avoid basic transient spikes, protecting etch processes.
LAM 203-140148-308 (Basic Variant): Isolation valve synced with LAM 810-1314-003; 200 ms response time, closes if pressure exceeds ±5% of setpoint (prevents chamber overpressurization).
LAM 716-028123-004: Medium-UHV sensor complementary to LAM 810-1314-003; Provides secondary pressure verification for critical 28nm runs, enhancing basic regulation reliability.
LAM 810-059223-312: Mid-range upgrade for LAM 810-1314-003; Adds dual-sensor redundancy and faster response, ideal for fabs scaling to 14nm–28nm medium-volume production.
LAM 853-17632-001: Single-channel gas filter compatible with LAM 810-1314-003; Filters process gases before chamber entry, preventing contamination that degrades basic vacuum stability.
Installation, commissioning and maintenance instructions
Installation preparation: Before installing LAM 810-1314-003, confirm compatibility with your LAM tool (low-end 790/legacy 2300 entry-level) and target gas (non-fluorinated only). Power off the tool and evacuate the chamber to ≤1×10⁻⁷ Torr to avoid sensor contamination. Mount the module via basic steel brackets (DIN rail/panel-mount), ensuring ≥8cm clearance from heat sources (e.g., MFC heaters) to maintain passive temperature compensation.
Connect vacuum lines: Inlet to process chamber (use 1/4” VCR fittings, torqued to 10 in-lbs ±1 in-lb with a basic torque wrench); control outputs to throttle valve and turbomolecular pump. For integration: Connect RS-485 to LAM PCS v4.0+ (use shielded cable to reduce interference) and digital I/O to LAM 839-001234-001 (MFC) for interlock. Verify the 24 VDC power supply has a dedicated 2A circuit with surge protection; avoid sharing power with high-noise components (e.g., basic RF generators) to prevent sensor signal distortion. Perform initial leak test (target ≤1×10⁻⁹ SCCM) via basic helium leak detector.
Commissioning: Power on the module, select the appropriate vacuum range (manual switch) for your process, and verify sensor accuracy with a secondary reference gauge (target deviation ≤±2.5% at 1×10⁻⁵ Torr). Use LAM calibration software (via RS-485) to adjust zero offset if needed. Perform 20 basic process cycles to confirm regulation stability (no ±3% pressure drift).
Maintenance suggestions: Perform weekly checks of LAM 810-1314-003—verify pressure setpoint vs. actual (±2.5% tolerance), inspect vacuum fittings for loose connections, and confirm RS-485 data transmission (no dropouts). Monthly, clean sensor ports with UHV-compatible isopropyl alcohol (99.9% purity) to remove residual gas deposits; check Viton® seals for signs of wear (cracks, hardening).
Every 12 months, calibrate the module with LAM 810-1314-CAL kit to maintain accuracy; replace seals if leaks are detected or after 12 months of use. For small-scale production lines, keep a spare capacitance manometer on hand—target replacement time: <1 hour to minimize tool downtime.
Service and guarantee commitment
LAM Research backs LAM 810-1314-003 with a 1-year standard warranty, covering defects in materials and workmanship for 28nm–90nm semiconductor use (non-fluorinated gas environments only). This warranty includes free replacement of faulty components (e.g., capacitance manometer, control board) and excludes normal wear items (e.g., seals, brackets).
Weekday technical support (8 AM–5 PM local time) is provided by LAM’s legacy basic systems team, accessible via the LAM Customer Portal or email, to assist with installation troubleshooting and calibration guidance. For extended protection, customers can purchase LAM’s Basic Mature-Node Vacuum Support Plan, which extends coverage to 2 years and includes: annual remote calibration assistance
Full 12-month warranty on all components
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All units are fully tested
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