NI PXI-2532B
NI PXI-2532B
NI PXI-2532B
NI PXI-2532B
NI PXI-2532B

NI PXI-2532B | PXI High-Density Matrix Switch Module

  • Brand:​ National Instruments
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    Model:​ PXI-2532B
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    Product Type:​ PXI Matrix Switch Module
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    Series:​ PXI Switch
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    Core Function:​ Provides high-density 4-wire signal routing for automated test systems with 64×16 matrix configuration.
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    Key Specs:​ 64×16 matrix, 4-wire multiplexing, 256 crosspoints, 300V switching capability.
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Part number: NI PXI-2532B
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Description

PXI-2532B: Product Overview
The National Instruments PXI-2532B is a high-density 4-wire matrix switch module designed for PXI-based test systems requiring extensive signal routing capabilities. This module provides a 64×16 cross-point matrix configuration, offering 256 individual signal paths that can be programmed to connect any of 64 inputs to any of 16 outputs. The architecture supports complex routing scenarios in automated test equipment (ATE) systems where multiple instruments need to be shared across numerous test points.
The module operates using electromechanical relays arranged in a matrix configuration, allowing flexible signal routing while maintaining signal integrity. Each cross-point can be independently controlled, enabling multiple simultaneous connections between different input and output pairs. The 4-wire (quad-pole) switching capability makes it suitable for applications requiring guarded measurements or resistance measurement applications where lead compensation is critical. The module is designed for systems testing electronic components, circuit boards, and subassemblies where high channel count and signal integrity are paramount.

NI PXI-2532B

NI PXI-2532B

PXI-2532B: Technical Specifications
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    Model Number:​ PXI-2532B
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    Manufacturer:​ National Instruments
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    Product Type:​ PXI Matrix Switch Module
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    Matrix Configuration:​ 64×16 cross-point matrix (256 points)
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    Switching Type:​ 4-wire (quad-pole) multiplexing
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    Maximum Voltage:​ 300V channel-to-channel
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    Carry Current:​ 1A maximum per channel
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    Switching Speed:​ 10ms typical (including settle time)
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    Contact Life:​ 1 million operations minimum
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    Contact Resistance:​ <2Ω typical
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    Off-Isolation:​ >90dB at 1MHz
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    Bandwidth:​ DC to 100MHz
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    Relay Type:​ Electromechanical relays
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    Control Interface:​ PXI trigger lines
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    Operating Temperature:​ 0°C to 55°C
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    Power Consumption:​ 6W typical

    NI PXI-2532B

    NI PXI-2532B

Core Features & Customer Value
The primary value of the PXI-2532B lies in its high channel density and flexible routing architecture. The 64×16 matrix configuration enables a single module to replace multiple smaller switching modules, reducing system size, cost, and complexity. For test engineers designing high-volume production test systems, this density means fewer chassis and modules are required to achieve the same test coverage, resulting in significant space and cost savings.
The 4-wire switching capability​ is essential for precision measurements where contact resistance could introduce errors. This feature enables true Kelvin (4-wire) resistance measurements, which is critical for accurately characterizing low-value resistors, contact resistance, and other applications where measurement accuracy is paramount. The matrix architecture allows multiple simultaneous connections, enabling parallel testing of multiple devices or test points, which significantly reduces test time in production environments.
The module’s electromechanical relay technology​ provides excellent signal integrity with low contact resistance and stable performance over time. While slower than solid-state alternatives, these relays offer superior DC characteristics and higher voltage handling capability. Integration with National Instruments’ Switch Executive software simplifies the programming of complex signal routes and provides visual feedback of current switch configurations.
Typical Applications
In semiconductor test systems, the module routes signals between parametric measurement units and multiple device pins for characterization and production testing of integrated circuits.
In aerospace and defense applications, the matrix switches between numerous sensors and data acquisition systems for structural health monitoring and component validation testing.
For circuit board test systems, the module connects test instruments to multiple test points on the board for in-circuit testing and functional validation.

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