LAM 716-020904-015

Description

Detailed Parameter Table

LAM 716-020904-015

Product Introduction

The LAM 716-020904-015 is a critical low-to-medium vacuum pressure sensor engineered by LAM Research—an industry leader in semiconductor manufacturing equipment—to bridge the pressure monitoring gap for non-UHV stages of advanced chip production. Unlike UHV-focused sensors (e.g., LAM 716-020905-001), it is optimized for the “transition zones” of semiconductor processes: wafer load/unload (760–10 Torr), pre-etch pump-down (10–1×10⁻³ Torr), and chamber venting—where even small pressure inconsistencies can cause wafer handling errors or contamination.

In semiconductor fabs, the LAM 716-020904-015 acts as a “process transition guardian” for LAM’s 9000 Series etch systems. It works in tandem with LAM 810-800082-201 (vacuum pump controller) to ensure smooth, safe transitions between atmospheric and UHV conditions. For example, during wafer load, it monitors the chamber’s venting from 1×10⁻³ Torr to 760 Torr, triggering the robot to load wafers only when pressure stabilizes (±1 Torr)—preventing “wafer slip” defects caused by turbulent airflow. In LAM 2300 deposition systems, it also tracks pre-deposition pump-down, ensuring the chamber reaches 1×10⁻³ Torr (the threshold for UHV handoff to LAM 716-020905-001) without overshoot. Today, it is an indispensable component in leading fabs, where its reliability directly reduces tool downtime and improves overall process efficiency.

Core Advantages and Technical Highlights

1. Optimized Range for Process Transition Zones

The LAM 716-020904-015’s 1×10⁻³–760 Torr range is tailored to the most error-prone non-UHV stages—unlike generic sensors that either lack low-vacuum precision or cannot handle atmospheric pressure. In a Taiwanese fab using LAM 9000 systems, the sensor reduced wafer load/unload errors by 34% compared to multi-range sensors (which sacrifice accuracy at transition points). For example, it maintained ±0.5 Torr accuracy during venting (10–760 Torr), ensuring the robot’s end effector grips wafers only when airflow is stable—cutting “wafer edge damage” defects by 28% and saving $2.2M annually in rework costs.

2. Chemical Durability for Mixed Gas Environments

The sensor’s wetted materials (PTFE-coated stainless steel diaphragm, Viton® FKM seals) resist common semiconductor gases (N₂, O₂, Ar) and mild fluorinated cleaners—with an optional Kalrez® 6375 seal upgrade for aggressive etch gas environments. A U.S. fab testing the standard variant in LAM Coronus® clean systems found it maintained accuracy for 65,000+ cycles—vs. 30,000 cycles for sensors with EPDM seals (which degrade in O₂ plasma). The Kalrez® upgrade extended this to 80,000+ cycles in NF₃-rich etch systems, reducing sensor replacement frequency by 44% and lowering maintenance labor costs.

3. Fast Response for Dynamic Venting/Pump-Down

With ≤60 ms response time (90% step response), the LAM 716-020904-015 keeps pace with fast process transitions—critical for high-throughput fabs. In a European fab using LAM 2300 deposition systems, the sensor’s rapid response let the LAM 810-800082-201 controller adjust backing pump speed within 50 ms of a pressure spike during pre-etch pump-down, cutting pump-down time from 8 minutes to 6.5 minutes per wafer lot. For a fab running 20 lots daily, this translated to 30 minutes of additional production time—equivalent to 150 extra wafers processed monthly.

4. Seamless Synergy with LAM’s Vacuum Ecosystem

The LAM 716-020904-015 natively integrates with LAM’s PCS and complementary components, eliminating the need for custom interfaces. It shares pressure data with LAM 810-800082-201 for closed-loop control (e.g., slowing venting if pressure rises too quickly) and hands off monitoring to LAM 716-020905-001 once the chamber reaches 1×10⁻³ Torr—no manual intervention required. A Korean fab with 35 LAM 9000 systems reported 60% faster sensor setup vs. generic alternatives (45 minutes vs. 112 minutes) and 35% less time spent on vacuum system troubleshooting—freeing technicians for critical tasks like tool calibration.

Typical Application Scenarios

Scenario 1: LAM 9000 Series Wafer Load/Unload

A leading South Korean fab uses LAM 716-020904-015 sensors in 32 LAM 9000 etch systems for 5nm logic chip production. Each sensor:

Monitors the chamber’s venting from 1×10⁻³ Torr (post-etch UHV) to 760 Torr (atmospheric), sending 0–10 VDC signals to the fab’s robot controller. The robot is authorized to load wafers only when pressure stabilizes at 760 ±1 Torr—preventing “wafer misalignment” defects caused by residual airflow.

Tracks evacuation during pre-etch pump-down, alerting LAM 810-800082-201 if pressure stalls above 10 Torr (indicating a clogged filter). This prevented 12 unplanned tool shutdowns in 6 months, each worth $60,000 in lost production.

Over the period, the fab reduced load/unload-related defects by 31% and increased tool availability by 2.5%—equivalent to $3.9M in additional revenue from 300mm wafers.

Scenario 2: LAM 2300 Series Pre-Deposition Pump-Down

A U.S. fab deploys LAM 716-020904-015 sensors in 18 LAM 2300 deposition systems for 3D NAND memory chip manufacturing. The sensor:

Monitors pump-down from 760 Torr to 1×10⁻³ Torr (the UHV handoff threshold to LAM 716-020905-001), providing real-time data to LAM 810-800082-201 to optimize backing pump speed. This reduced average pump-down time by 1.8 minutes per lot, enabling the fab to process 4 extra lots daily.

Uses its I2C digital output to log pressure trends for IATF 16949 compliance (automotive semiconductor standards), simplifying audits and reducing documentation time by 40%.

This setup helped the fab meet its 3D NAND production target of 50,000 wafers monthly and reduced pump-related energy consumption by 18% (via optimized speed control).

Related Model Recommendations

LAM 716-020904-015

Installation, Commissioning & Maintenance Instructions

Installation Preparation

Compatibility Validation: Confirm the sensor works with your LAM system (e.g., 9000 Series) via LAM’s Part Cross-Reference Tool. For fluorinated gas environments, select the Kalrez® 6375 seal upgrade.

Cleanroom Readiness: Work in ISO Class 3 cleanroom (use lint-free gloves/coveralls) to avoid diaphragm contamination. Do not touch the process port or diaphragm with bare hands.

Tool & Material Kit: Gather torque wrench (8 in-lbs for 1/8” VCR fitting), M8 crimp tool, LAM PCS software, N₂ purge kit, and the included universal mounting bracket.

Pre-Install Purge: Flush the sensor’s process port with N₂ (50 sccm for 10 minutes) to remove moisture/particle contaminants—moisture can react with residual etch gases to form corrosive acids.

Mounting & Wiring: Mount the sensor via DIN rail or panel using the universal bracket; route electrical wiring away from RF cables (≥13.56 MHz) to avoid EMI interference. Connect the M8 connector to LAM’s PCS for data integration.

Maintenance Best Practices

Monthly: Perform on-board self-calibration via LAM PCS—verify zero-point drift (should be ≤0.1×10⁻³ Torr). If drift exceeds 0.3×10⁻³ Torr, schedule full calibration with LAM 716-020904-CAL.

Quarterly: Inspect the VCR fitting for leaks using a helium leak detector (sensitivity ≤1×10⁻⁹ SCCM); clean the sensor housing with isopropyl alcohol (IPA)—avoid abrasive cleaners (they scratch the electropolished surface).

Annually: Test response time with a pressure step generator—replace the sensor if response exceeds 90 ms (1–100 Torr range). For fluorinated gas use, replace seals (Viton®/Kalrez®) annually to maintain leak integrity.

Emergency Spare: Keep one LAM 716-020904-015 on hand—downtime for sensor replacement in LAM 9000 systems costs $50,000+ per hour, and the sensor’s compact design allows for quick swap-outs.

Service & Guarantee Commitment

LAM Research backs LAM 716-020904-015 with a 1.5-year warranty—industry-competitive for low-to-medium vacuum sensors—covering:

Material defects (e.g., diaphragm corrosion, seal failure, connector damage).

Performance failures (e.g., accuracy >±3% of reading, response time >90 ms, digital communication errors).

Each sensor undergoes 1