cFP-CB-3: Product OverviewThe National Instruments cFP-CB-3 is a 3-slot backplane unit designed for the Compact FieldPoint distributed I/O platform, serving as the physical and electrical interface between I/O modules and the control network. This unit functions as an expansion chassis that houses up to three Compact FieldPoint I/O modules while providing the communication interface to host systems. The backplane includes an integrated communication controller that manages data exchange between the I/O modules and external control systems via various network protocols.Installed in industrial environments, the unit provides the mechanical mounting, power distribution, and communication infrastructure for Compact FieldPoint I/O modules. The integrated screw terminal blocks facilitate reliable field wiring connections while maintaining the environmental protection required for harsh industrial applications. The communication controller supports multiple industrial protocols including Modbus TCP, allowing seamless integration with various control systems including PLCs, DCS systems, and PC-based controllers.As part of the Compact FieldPoint system, this backplane enables distributed I/O architecture where measurement and control points can be located close to field devices rather than centralized in a control room. This approach reduces wiring costs and improves signal integrity by minimizing cable runs. The rugged design withstands industrial environments with extended temperature operation, high immunity to electrical noise, and robust construction suitable for direct machine mounting.
NI CFP-CB-3
cFP-CB-3: Technical Specifications
• Model Number: cFP-CB-3
• Manufacturer: National Instruments
• Product Type: Compact FieldPoint Backplane
• Number of Slots: 3 slots for I/O modules
• Communication Interface: 10/100Base-T Ethernet
• Protocols: Modbus TCP, NI industrial networking protocols
• Power Supply: 9-30V DC input
• Power Consumption: 1.5W (base unit only)
• Operating Temperature: -40°C to 70°C
• Storage Temperature: -40°C to 85°C
• Relative Humidity: 5% to 95% non-condensing
• Vibration Immunity: 5g operational
• Shock Immunity: 50g operational
• Connection: Removable screw terminal blocks
• Isolation: 500V continuous (channel-to-bus)
• Enclosure Rating: IP30 (base unit)
• Dimensions: 135 x 118 x 105 mm
NI CFP-CB-3
Core Features & Customer ValueDistributed I/O Architecture: The unit enables placement of I/O points close to field devices, significantly reducing wiring costs and improving signal integrity by minimizing long cable runs. This distributed approach allows for modular system design where I/O can be located exactly where needed throughout a facility or machine. The benefit is reduced installation time and cost while improving measurement accuracy through shorter signal paths.Integrated Communication Capability: The built-in communication controller handles protocol conversion and data management, providing a transparent interface between I/O modules and host systems. This eliminates the need for external protocol converters or additional communication hardware, simplifying system architecture and reducing component count. The support for standard industrial protocols ensures compatibility with a wide range of control equipment from different manufacturers.Rugged Industrial Design: Constructed for harsh environments, the unit operates reliably in temperature extremes and withstands vibration and shock typical in industrial settings. The robust construction and screw terminal connections ensure reliable operation in applications where commercial-grade equipment would fail. This durability reduces maintenance requirements and extends service life in demanding applications.Typical ApplicationsIn distributed control systems, the unit serves as a remote I/O drop located near field devices such as sensors and actuators, communicating with a central controller via Ethernet. This architecture is commonly used in water treatment facilities, where I/O points are distributed across large geographical areas but require centralized monitoring and control.For machine automation, the backplane houses I/O modules directly on manufacturing equipment, providing local interface to sensors and actuators while communicating with the main machine controller. This approach is ideal for complex machinery where I/O points are concentrated in specific areas but need to be integrated into a larger control system.In building automation, multiple units are deployed throughout a facility to monitor and control HVAC equipment, lighting systems, and security devices. The Modbus TCP protocol support enables integration with building management systems from various manufacturers, providing flexibility in system design and expansion.
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