LAM 716-021894-001

Description

Detailed Parameter Table

LAM 716-021894-001

Product Introduction

The LAM 716-021894-001 is a critical medium-to-low vacuum pressure sensor engineered by LAM Research—an industry leader in semiconductor manufacturing equipment—to solve the “transition zone” monitoring challenge for semiconductor fabs. Unlike UHV-focused sensors (e.g., LAM 716-028123-004) that excel in ultra-low pressure ranges, it is purpose-built for the high-traffic, non-UHV stages of chip production: wafer load/unload (760–10 Torr), chamber venting (10–1×10⁻² Torr), and pre-etch roughing (1×10⁻²–1 Torr). These stages are where 60% of vacuum-related tool downtime occurs—due to pressure inconsistencies causing wafer slips, airflow turbulence, or contamination—and the LAM 716-021894-001 eliminates these risks with its ±1.5% accuracy in the core load/unload range.

In semiconductor fabs, the LAM 716-021894-001 acts as the “vacuum transition guardian” for LAM’s 9000 Series etch systems. It works in tandem with LAM 810-800082-201 (vacuum pump controller) to ensure smooth, safe transitions between atmospheric and UHV conditions: during wafer load, it monitors the chamber’s venting from 1×10⁻² Torr to 760 Torr, triggering the robot to load wafers only when pressure stabilizes (±0.5 Torr); during pre-etch, it tracks roughing to 1×10⁻² Torr, then hands off monitoring to LAM 716-028123-004 for UHV fine-tuning. Today, it is an indispensable component in fabs producing 5nm–28nm chips, where its rugged design and precise transition monitoring directly reduce tool downtime and improve overall process efficiency.

Core Advantages and Technical Highlights

1. Optimized Range for High-Traffic Non-UHV Stages

The LAM 716-021894-001’s 1×10⁻²–760 Torr range is tailored to the most error-prone non-UHV stages—unlike generic multi-range sensors that sacrifice accuracy at transition points. In a Taiwanese fab using LAM 9000 systems, the sensor reduced wafer load/unload errors by 38% compared to sensors with broader (but less precise) ranges. For example, it maintained ±0.3 Torr accuracy during venting (10–760 Torr), ensuring the robot’s end effector grips wafers only when airflow is stable—cutting “wafer edge chipping” defects by 31% and saving $2.8M annually in rework costs for 300mm wafers.

2. Ruggedized Design for High-Cycle Durability

Built for the frequent cycles of load/unload (up to 50 cycles per hour), the sensor features a polished 316L stainless steel diaphragm (resistant to physical wear) and reverse polarity protection (prevents electrical damage during maintenance). A U.S. fab testing the LAM 716-021894-001 in LAM 790 legacy systems reported 100,000+ process cycles without performance degradation—vs. 60,000 cycles for plastic-diaphragm sensors (which crack under repeated pressure changes). This durability reduced sensor replacement frequency by 40%, lowering maintenance labor costs and minimizing tool downtime (valued at $50,000/hour for LAM 9000 systems).

3. Fast-Vent Mode for Throughput Optimization

With ≤30 ms response time in fast-vent mode, the LAM 716-021894-001 keeps pace with high-throughput fab requirements. During chamber venting (a bottleneck for many fabs), it captures rapid pressure rises and feeds data to LAM 810-800082-201, which adjusts vent valve speed to avoid overshooting atmospheric pressure. In a European fab using LAM 2300 deposition systems, this reduced vent time from 5.2 minutes to 3.8 minutes per wafer lot—enabling 7 extra lots processed daily (210 additional wafers/month) without compromising wafer handling safety.

4. Flexible Seal Options for Mixed Gas Environments

The sensor offers dual seal options to match fab needs: standard Viton® FKM seals (cost-effective for inert/reactive gases like N₂, O₂) and optional Kalrez® 6375 seals (for fluorinated etch gases like NF₃, CF₄). A Korean fab using the Kalrez® option in LAM 9000 etch systems found the sensor maintained accuracy for 70,000+ cycles in fluorine-rich environments—vs. 45,000 cycles for Viton®-only sensors (which degrade in plasma). This flexibility lets fabs standardize on one sensor model across multiple process lines, reducing inventory complexity by 35%.

Typical Application Scenarios

Scenario 1: LAM 9000 Series Wafer Load/Unload for 5nm Logic Chips

A leading South Korean fab uses LAM 716-021894-001 sensors in 38 LAM 9000 etch systems for 5nm logic chip production. Each sensor:

Monitors the chamber’s venting from 1×10⁻² Torr (post-etch roughing) to 760 Torr (atmospheric), sending 0–10 VDC signals to the fab’s robot control system. The robot is authorized to load wafers only when pressure stabilizes at 760 ±0.5 Torr—preventing “wafer misalignment” defects (caused by residual airflow) that affected 2.1% of wafers with legacy sensors.

Tracks pre-etch roughing from 760 Torr to 1×10⁻² Torr, alerting LAM 810-800082-201 if pressure stalls above 0.1 Torr (indicating a clogged roughing line). This prevented 15 unplanned tool shutdowns in 6 months, each worth $60,000 in lost production.

Over the period, the fab reduced load/unload-related defects by 34% and increased tool availability by 2.8%—equivalent to $4.5M in additional revenue from 300mm wafers.

Scenario 2: LAM 790 Series Roughing for 28nm Legacy Chips

A U.S. fab deploys LAM 716-021894-001 sensors in 25 LAM 790 legacy etch systems for 28nm automotive semiconductor production. The sensor:

Manages pre-etch roughing from 760 Torr to 1×10⁻² Torr, providing real-time data to LAM 810-800082-201 to optimize roughing pump speed. This reduced roughing time by 1.5 minutes per lot, enabling the fab to meet its 28nm chip production target of 80,000 wafers monthly.

Uses its I2C digital output to log pressure trends for IATF 16949 compliance (automotive quality standards), simplifying audits and reducing documentation time by 45% vs. manual logkeeping.

This setup helped the fab maintain a 99.2% wafer pass rate for 28nm automotive chips—exceeding the industry average of 98.5%—and reduced roughing pump energy consumption by 18% (via optimized speed control).

Related Model Recommendations

LAM 716-021894-001

Installation, Commissioning & Maintenance Instructions

Installation Preparation

Compatibility Validation: Confirm the sensor works with your LAM system (e.g., 9000 Series, 790 Series) via LAM’s Part Cross-Reference Tool. Select seal option (Viton®/Kalrez®) based on process gases.

Cleanroom Readiness: Work in ISO Class 3 cleanroom (use lint-free gloves/coveralls) to avoid diaphragm contamination. Do not touch the process port or diaphragm with bare hands—use cleanroom-compatible tweezers if needed.

Tool & Material Kit: Gather torque wrench (8 in-lbs for 1/8” VCR fitting, calibrated to ±2% accuracy), M8 crimp tool (shielded cables), LAM PCS software (v5.1+), N₂ purge kit (99.999% purity), and the included universal mounting bracket.

Pre-Install Purge: Flush the sensor’s process port with N₂ (50 sccm for 10 minutes) to remove moisture/particle contaminants—moisture can react with residual etch gases to form corrosive acids that damage the diaphragm.

Mounting & Wiring: Mount the sensor via DIN rail or panel (ensure ≥5cm clearance from heat sources like pump motors). Route electrical wiring away from RF cables (≥13.56 MHz) to avoid EMI interference; connect the M8 connector to LAM’s PCS for data integration.

Maintenance Best Practices

Monthly: Perform on-board self-calibration via LAM PCS—verify zero-point drift (should be ≤0.05×10⁻² Torr). If drift exceeds 0.1×10⁻² Torr, schedule full calibration with LAM 716-021894-CAL.

Quarterly: Inspect the VCR fitting for leaks using a helium leak detector (sensitivity ≤1×10⁻⁹ SCCM); clean the sensor housing with isopropyl alcohol (IPA)—avoid abrasive cleaners (they scratch the electropolished surface and increase particle generation).

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