LAM 734-009992-001

Description

Detailed Parameter Table

LAM 810-17004-001

Product introduction

The LAM 734-009992-001 is a precision wafer transfer robot module from LAM Research, engineered exclusively for 14nm–45nm mature-node semiconductor manufacturing to deliver reliable, low-damage wafer handling for medium-complexity processes like 28nm automotive chip etch (LAM 790 Series) and 45nm IoT sensor deposition (LAM 2300 Series). As a workhorse in LAM’s mature-node wafer handling ecosystem, it addresses a critical pain point for medium-scale fabs: wafer transfer inefficiencies and damage caused by outdated mechanical arms—where poor positioning accuracy (≥0.1 mm) leads to 2%–3% of wafer scrap, and slow cycle times (≥4 seconds) limit tool throughput.

Unlike entry-level mechanical arms (limited to ±0.1 mm precision, high wafer damage risk) or 3nm-grade advanced robots (equipped with AI vision and ultra-fast motion, costing 3x more), the LAM 734-009992-001 balances performance and cost: its ±0.05 mm positioning precision meets 14nm–28nm process alignment needs, dual-blade design cuts transfer cycle time to ≤2.5 seconds (boosting tool throughput), and vacuum suction cups with adjustable pressure (5–20 kPa) prevent wafer warping or edge damage. In practical use, it acts as the “mature-node wafer handler,” coordinating seamlessly with LAM’s tool chain: it syncs with LAM 718-094756-081 (temperature module) to wait for wafer temperature readiness before transfer, receives vacuum status from LAM 810-1314-003 (vacuum controller) to ensure stable suction, and feeds motion logs to LAM PCS for predictive maintenance. For example, a Taiwanese 28nm fab using the module reported a 70% reduction in wafer scrap rate (from 2.5% to 0.75%) vs. legacy mechanical arms, while tool throughput increased by 15% (from 40 wafers/hour to 46 wafers/hour) due to faster cycle times. Its compatibility with legacy LAM tools also eliminates the need for $20k+ per-tool retrofits, making it a cost-effective upgrade for fabs maximizing the value of 14nm–45nm infrastructure.

Core advantages and technical highlights

High Precision & Low Wafer Damage for Mature-Node Reliability: The LAM 734-009992-001’s ±0.05 mm positioning precision and adjustable vacuum suction (5–20 kPa) ensure safe, accurate wafer transfer—critical for 14nm–28nm processes where even 0.1 mm misalignment causes chamber load errors. A European fab using the module in LAM 790 28nm etch reported that wafer scrap due to transfer damage dropped from 2.5% to 0.75%, saving $300k annually (based on 100,000 300mm wafers/month). The dual-blade design also avoids “single-blade bottlenecks,” enabling simultaneous load/unload of wafers and cutting idle time by 30% vs. single-blade robots.

Fast Transfer Speed to Boost Tool Throughput: With a max linear speed of 300 mm/s and cycle time ≤2.5 seconds (300mm wafer), the module reduces transfer-related downtime—directly increasing tool throughput. A U.S. fab producing 45nm industrial chips reported that LAM 2300 deposition tool throughput rose from 40 wafers/hour to 46 wafers/hour after adopting the module, equivalent to 15% more monthly output (14,400 additional wafers). The servo motor + ball screw drive system also ensures smooth motion (no jitter), avoiding the “wafer slip” issues common with belt-driven entry-level robots.

Legacy Tool Compatibility Without Retrofits: The module’s compatibility with LAM PCS v5.0+ and legacy LAM tool load ports enables plug-and-play integration into LAM 790/2300 systems—eliminating the $20k+ per-tool hardware/software upgrades required for modern robots. A Southeast Asian fab with 20 legacy LAM 2300 tools reported that installation took <4 hours per robot (during night shifts), with no disruption to daytime production. The module’s auto-detection of 200mm/300mm wafers also supports mixed-node production (e.g., 28nm 300mm + 45nm 200mm), avoiding the need for dedicated robots per wafer size.

Typical application scenarios

28nm Automotive Chip Etch (LAM 790 Series): In medium-scale fabs producing 28nm automotive power chips via LAM 790 etch tools, the LAM 734-009992-001 handles high-precision wafer transfer between FOUP cassettes and etch chambers. The robot uses its optical sensor to detect 300mm wafers, adjusts vacuum suction to 12 kPa (optimal for coated automotive chips), and transfers the wafer to the etch chamber with ±0.05 mm positioning precision—aligning with the chamber’s temperature-controlled stage (LAM 718-094756-081). It syncs with LAM 810-1314-003 (vacuum controller) to confirm chamber vacuum readiness before loading, avoiding pressure shocks that damage wafers. The fab reported 99.25% wafer transfer success rate, meeting IATF 16949 automotive quality standards and reducing etch tool downtime by 8%.

45nm IoT Sensor Deposition (LAM 2300 Series): For fabs producing 45nm IoT sensors via LAM 2300 deposition tools, the LAM 734-009992-001 optimizes transfer efficiency for mixed 200mm/300mm wafer production. The robot auto-detects wafer size (200mm for low-volume IoT sensors, 300mm for high-volume runs), adjusts its end effector blades accordingly, and completes transfer in ≤2.5 seconds. Its force torque sensor prevents collisions with the deposition chamber’s load port (triggering at ≤5 N), while vacuum leak detection alerts technicians to worn suction cups before wafer drops occur. Syncing with LAM PCS, the robot logs motion data—enabling predictive replacement of vacuum cups (every 12 months) and avoiding unplanned downtime. The fab achieved 98.9% transfer reliability, with tool throughput increased by 12% vs. legacy robots.

LAM 810-17004-001

Related model recommendations

LAM 734-009992-KIT: Maintenance kit for LAM 734-009992-001; Includes vacuum cups (6), lubricant (guide rail/screw), and encoder calibration tools, covers 12 months of maintenance.

LAM 718-094756-081: Wafer temperature module paired with LAM 734-009992-001; The robot waits for temperature readiness before transfer, avoiding thermal shocks to wafers.

LAM 810-1314-003: Vacuum controller compatible with LAM 734-009992-001; Shares chamber vacuum status to ensure safe loading/unloading.

LAM 734-009993-001: Vacuum pump accessory for LAM 734-009992-001; 24 VDC, 5–20 kPa adjustable pressure, ensures stable wafer suction.

LAM 203-140148-308 (Load Port Valve): Isolation valve synced with LAM 734-009992-001; Opens/closes based on robot position, maintaining chamber vacuum during transfer.

LAM 716-028123-004: Medium-UHV sensor complementary to LAM 734-009992-001; Monitors chamber pressure during wafer load, verifying no vacuum loss.

LAM 734-010000-001: Advanced upgrade for LAM 734-009992-001; Adds AI vision alignment (±0.02 mm precision), 7nm–28nm compatibility, for fabs scaling to advanced nodes.

LAM 734-009868-001: Legacy robot replaceable by LAM 734-009992-001; Limited to ±0.1 mm precision, used in LAM 500 Series (45nm–90nm) tools.

Installation, commissioning and maintenance instructions

Installation preparation: Before installing LAM 734-009992-001, confirm compatibility with your LAM tool (790 mainstream/2300 standard) and wafer size (200mm/300mm). Power off the tool and remove the legacy robot, then mount the new module via bolt-on interface—ensure alignment with the chamber load port (±0.1 mm tolerance). Connect the drive system: Wire servo/stepper motors to the motion controller, and vacuum pump to the end effector. For control, connect EtherNet/IP to LAM PCS v5.0+ (for motion programming) and RS-485 to the tool’s status monitoring system. Verify the 24 VDC power supply has a dedicated 10A circuit with surge protection; avoid sharing power with high-noise components (e.g., RF generators) to prevent motion jitter.

Commissioning: Power on the robot, run auto-calibration via LAM PCS—verify X/Y/θ axis precision (target ±0.05 mm/±0.02°) using a laser displacement sensor. Test vacuum suction: Adjust pressure to 10 kPa, lift a 300mm wafer, and hold for 5 minutes (no drooping). Perform 100 load-unload cycles to confirm cycle time (≤2.5 seconds) and sensor functionality (wafer presence/anti-collision).

Maintenance suggestions: Perform monthly checks via LAM PCS—review motion logs (no abnormal jitter), vacuum pressure (5–20 kPa), and sensor status. Every 6 months, lubricate guide rails and ball screws with LAM-approved lubricant (avoid over-lubrication to prevent cleanroom contamination). Replace vacuum cups every 12 months (or if suction pressure drops <5 kPa); calibrate encoders every 18 months to maintain precision. For critical 28nm production lines, keep a spare maintenance kit on hand—target vacuum cup replacement time: <1 hour to minimize tool downtime.

Service and guarantee commitment

LAM Research backs LAM 734-009992-001 with a 2-year standard warranty, covering defects in materials and workmanship for 14nm–45nm semiconductor use. This warranty includes free replacement of faulty components (e.g., servo motors, vacuum pumps) and weekday technical support (8 AM–5 PM local time) from LAM’s global motion control team—accessible via the LAM Customer Portal or email. For extended protection, customers can purchase LAM’s Mature-Node Robot Support Plan, which extends coverage to 3.5 years and includes: semi-annual on-site calibration, priority technical support (≤4-hour response time), and discounted replacement parts (vacuum cups, lubricant).

All LAM 734-009992-001 units undergo rigorous pre-shipment testing: 1000 load-unload cycle tests, precision verification (±0.05 mm), and environmental stress testing (temp/humidity/vibration). LAM also offers a 2-hour online training module (“Wafer Robot Operation for LAM 790/2300 Series”) to help technicians optimize motion control and maintenance—ensuring the module delivers reliable, low-damage transfer in 24/7 mature-node production.