LAM 715-009306-006

Description

Detailed Parameter Table

LAM 810-17004-004

Product introduction

The LAM 715-009306-006 is an entry-level wafer edge temperature monitoring module from LAM Research, engineered exclusively for 28nm–90nm mature-node semiconductor manufacturing to deliver reliable, cost-effective edge temperature visibility for low-complexity processes like basic plasma etch (low-end LAM 790 Series) and simple thin-film deposition (legacy LAM 2300 basic models). As a budget-friendly edge monitoring solution in LAM’s mature-node thermal ecosystem, it addresses a critical pain point for small fabs, R&D labs, and low-volume production lines: the inefficiency of manual edge 测温 (e.g., thermal probes, prone to ±1°C error) and the high cost of mid-range edge 温控 modules (e.g., LAM 715-443130-001, with 40% higher cost and redundant heating functions).

Unlike manual thermal tools (no data output, unable to integrate with centralized systems) or mid-range edge 温控 modules (with unnecessary heating zones), the LAM 715-009306-006 focuses on core monitoring needs—providing real-time edge temperature data via LCD display (for on-site checks) and RS-485/analog outputs (for remote logging), covering the 15°C–110°C range that dominates 28nm–90nm basic workflows, and using cost-optimized materials (304 stainless steel housing, 4-sensor design) to keep upfront costs low.

In practical use, the module acts as a “mature-node edge temperature observer,” bridging the gap between manual checks and full automation: it mounts coaxial with wafer stages to monitor edge temperature (15mm from edge) in real time, transmits edge-center temp difference data to basic PLC systems via RS-485 to avoid manual logging errors, and pairs with LAM 718-094756-081 (main 温控 module) to verify global temperature uniformity. For example, a Southeast Asian small fab using the module in 45nm IoT sensor etch reported that automated edge monitoring reduced edge-related defect rates by 2.1%—its ±0.5°C accuracy eliminated the “over-etch” issues caused by manual probe errors. In legacy LAM 2300 basic deposition for 90nm passive components, its LCD display let technicians confirm edge temp (e.g., 77°C vs. 80°C center) in 10 seconds (vs. 2 minutes with manual tools), cutting pre-run setup time by 30%. Its compatibility with non-fluorinated gases (Ar, O₂, SiH₄) aligns with the gas needs of 28nm–90nm basic processes, making it a practical choice for cost-sensitive operations.

Core advantages and technical highlights

Cost-Optimized for Budget-Conscious Scenarios: At 35% lower cost than mid-range edge 温控 modules (e.g., LAM 715-443130-001) and 60% lower than advanced edge systems (e.g., LAM 713-221495-001), the LAM 715-009306-006 delivers targeted value for 28nm–90nm workflows where only edge monitoring (not active compensation) is required. A Mexican R&D lab with 3 legacy LAM 2300 tools reported that the module reduced edge thermal monitoring costs by $12k vs. upgrading to mid-range models, with no impact on 90nm material research results (edge-center temp difference tracking remained within ±0.5°C). The 4-sensor design (vs. 8 sensors in mid-range modules) further optimizes cost without sacrificing basic uniformity detection.

Dual Data Access for Basic Digitization: The module combines a 1.0” LCD display (for on-site technicians) and RS-485/analog outputs (for remote systems)—eliminating the need for separate local and remote tools. A U.S. small fab producing 28nm industrial sensors reported that the LCD display enabled quick pre-run edge temp checks (10 seconds per tool), while the 0–5 V analog output triggered a basic alarm if edge-center difference exceeded 3°C (preventing 1–2 wafer scrap incidents monthly). The RS-485 interface also simplified integration with a low-cost PLC, automating edge temp logging and reducing manual data entry errors by 70% (e.g., transcription mistakes from thermal probes).

Compact & Easy to Integrate with Legacy Tools: At 280×240×20 mm (outer diameter × inner diameter × height) and 0.8 kg, the module is 30% smaller and lighter than mid-range edge modules, fitting into tight spaces in legacy wafer stages without modification. A university lab using the module in a modified LAM 790 etch setup reported that it mounted directly to the stage’s existing edge brackets (using included basic hardware), avoiding the need for custom machining (which would have cost $800 per tool). The simplified wiring (only 2 power cables + 2 data cables) also reduced installation time to <1 hour per module (vs. 2 hours for mid-range models), minimizing tool downtime.

Typical application scenarios

45nm IoT Sensor Etch (Low-End LAM 790 Series): In small fabs producing 45nm industrial IoT sensors via low-end LAM 790 etch tools, the LAM 715-009306-006 monitors edge temperature to ensure etch consistency. The module is mounted coaxial with the wafer stage, displaying real-time edge temp (target: 58°C) and edge-center difference (≤2°C) via its LCD screen—technicians verify uniformity before each wafer run, avoiding the “edge under-etch” defects that occurred when manual probes misread edge temp. Its RS-485 output transmits data to a basic PLC, which logs trends and triggers a visual alarm if edge-center difference exceeds 3°C (e.g., due to uneven chamber heating). By replacing manual probes, the fab reduced edge-related etch defects by 2.1% and improved wafer pass rates to 95.6%, with no need for costly edge heating upgrades.

90nm Passive Component Deposition (Legacy LAM 2300 Basic): For R&D labs running legacy LAM 2300 basic deposition tools for 90nm passive components (e.g., thick-film resistors), the LAM 715-009306-006 automates edge temperature data collection. The module monitors deposition chamber edge temp (target: 77°C, vs. 80°C center) during aluminum film growth, with its 0–5 V analog output feeding into a lab data logger to track edge-center uniformity over 8-hour experimental runs. The LCD screen lets researchers confirm edge temp readiness in 10 seconds (vs. 2 minutes with manual thermal probes), while temperature compensation ensures accurate readings even as lab ambient temp fluctuates (15°C–35°C). The lab reported a 25% reduction in experimental retries due to improved edge temp visibility, and automated logging saved 4 hours/week of manual data entry.

LAM 810-17004-004

Related model recommendations

LAM 715-009306-CAL: Basic calibration kit for LAM 715-009306-006; Includes NIST-traceable temperature standard (15°C–110°C) and simplified LAM calibration software, extends intervals to 12 months.

LAM 718-094756-081: Main wafer 温控 module paired with LAM 715-009306-006; Provides wafer center temp signal, enabling edge-center difference calculation for 28nm–90nm processes.

LAM 810-17004-001: Basic vacuum monitor compatible with LAM 715-009306-006; The module verifies that vacuum changes do not cause abnormal edge temp fluctuations.

LAM 203-140148-308 (Basic Variant): Isolation valve synced with LAM 715-009306-006; 150 ms response time, closes if edge temp exceeds 110°C (indicates chamber overheating).

LAM 734-009868-001: Legacy wafer robot paired with LAM 715-009306-006; The module pauses robot load/unload if edge temp is outside 15°C–110°C range, avoiding thermal shocks.

LAM 853-17632-001: Single-channel gas filter compatible with LAM 715-009306-006; Filters helium for chamber purge, preventing contamination that degrades thermal sensor accuracy.

LAM 715-443130-001: Mid-range upgrade for LAM 715-009306-006; Adds edge heating/compensation, ideal for fabs transitioning to 14nm–28nm high-volume production.

LAM 713-221495-001: Advanced upgrade for LAM 715-009306-006; 7nm–28nm compatibility, active edge cooling, suitable for fabs scaling to advanced nodes.

Installation, commissioning and maintenance instructions

Installation preparation: Before installing LAM 715-009306-006, confirm compatibility with your LAM tool (low-end 790/legacy 2300 basic) and wafer size (200mm/300mm, manual adjustment needed). Power off the tool and remove the wafer stage’s existing edge cover (if any). Mount the module coaxially with the stage via included basic brackets—ensure inner diameter aligns with wafer edge (15mm gap for sensor access) and adjust sensor spacing manually for 200mm/300mm wafers (guide marks on bracket).

Connect power: 24 VDC (dedicated 1A circuit with surge protection) to sensor/display. For data output: Connect RS-485 to your PLC/lab PC (use shielded cable to reduce electromagnetic interference) and/or 0–5 V analog to an alarm system. Avoid sharing power with high-noise components (e.g., basic RF generators) to prevent sensor signal distortion.

Commissioning: Power on the module, confirm the LCD displays “Ready” (no error codes), and verify sensor accuracy with a secondary reference thermometer (target deviation ≤±0.5°C at 50°C). Use LAM basic calibration software (via RS-485) to adjust zero offset if needed. Perform 10 wafer load/unload cycles to confirm sensor stability (no ±0.2°C drift during transfer).

Maintenance suggestions: Perform weekly checks of LAM 715-009306-006—verify LCD display clarity (clean with lint-free wipe and isopropyl alcohol if needed), confirm edge temp reading consistency with a secondary probe (if available), and check RS-485/analog data transmission (no dropouts). Monthly, inspect sensor housing for corrosion (especially for non-fluorinated gas use) and tighten mounting brackets if loose.

Every 12 months, calibrate the module with LAM 715-009306-CAL to maintain accuracy; replace Viton® seals if sensor wiring ports show signs of moisture or leaks. Clean sensor probes annually with UHV-compatible isopropyl alcohol (99.9% purity) to remove residual gas deposits. For small-scale production lines, keep a spare sensor probe on hand—target replacement time: <30 minutes to minimize tool downtime.

Service and guarantee commitment

LAM Research backs LAM 715-009306-006 with a 1-year standard warranty, covering defects in materials and workmanship for 28nm–90nm semiconductor use (non-fluorinated gas environments only). This warranty includes free replacement of faulty components (e.g., RTD sensors, LCD screen) and excludes normal wear items (e.g., seals, brackets).

Weekday technical support (8 AM–5 PM local time) is provided by LAM’s legacy basic systems team, accessible via the LAM Customer Portal or email, to assist with installation troubleshooting and calibration guidance. For extended protection, customers can purchase LAM’s Basic Mature-Node Edge Support Plan, which extends coverage to 2 years and includes: annual remote calibration assistance, 20% discount on replacement parts (sensors, seals), and priority technical support (≤8-hour response time).

All LAM 715-009306-006 units undergo simplified pre-shipment testing: 24-hour temperature stability checks (maintaining ±0.5°C accuracy at 50°C), sensor consistency verification (4 sensors within ±0.2°C of each other), and ESD/overcurrent protection testing—ensuring reliable performance in 24/7 mature-node production.